GND plane and vias on a two layer PCB

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I'm trying to build my first two-layer PCB layout using this example schema:



enter image description here



I'm using SMD elements, which I would place on the top layer. Also I would create a ratsnet area as GND on the top layer.



I would create some ratsnet area for the SW pin, the output inductor pins and the boost capacitor pins. In that areas I would put some vias and connect them with a ratsnet on the bottom layer.



I'm not quite sure if this is correct so far or if I misunderstood the example. Because then I do not understand the 'additional vias on the GND' of the capacitors.



If the GND area should be on the bottom layer, what about the trace from the SW-pin?










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  • What do you mean by a "ratsnest area"? Usually the "ratsnest" are the lines your CAD tool shows to indicate connections that haven't been made yet. There shouldn't be any ratsnest left when the design is complete.
    – The Photon
    1 hour ago










  • @ThePhoton I'm using Eagle CAD. Drawing a polygon and then use 'ratsnet'
    – user3142695
    1 hour ago
















up vote
3
down vote

favorite












I'm trying to build my first two-layer PCB layout using this example schema:



enter image description here



I'm using SMD elements, which I would place on the top layer. Also I would create a ratsnet area as GND on the top layer.



I would create some ratsnet area for the SW pin, the output inductor pins and the boost capacitor pins. In that areas I would put some vias and connect them with a ratsnet on the bottom layer.



I'm not quite sure if this is correct so far or if I misunderstood the example. Because then I do not understand the 'additional vias on the GND' of the capacitors.



If the GND area should be on the bottom layer, what about the trace from the SW-pin?










share|improve this question







New contributor




user3142695 is a new contributor to this site. Take care in asking for clarification, commenting, and answering.
Check out our Code of Conduct.



















  • What do you mean by a "ratsnest area"? Usually the "ratsnest" are the lines your CAD tool shows to indicate connections that haven't been made yet. There shouldn't be any ratsnest left when the design is complete.
    – The Photon
    1 hour ago










  • @ThePhoton I'm using Eagle CAD. Drawing a polygon and then use 'ratsnet'
    – user3142695
    1 hour ago












up vote
3
down vote

favorite









up vote
3
down vote

favorite











I'm trying to build my first two-layer PCB layout using this example schema:



enter image description here



I'm using SMD elements, which I would place on the top layer. Also I would create a ratsnet area as GND on the top layer.



I would create some ratsnet area for the SW pin, the output inductor pins and the boost capacitor pins. In that areas I would put some vias and connect them with a ratsnet on the bottom layer.



I'm not quite sure if this is correct so far or if I misunderstood the example. Because then I do not understand the 'additional vias on the GND' of the capacitors.



If the GND area should be on the bottom layer, what about the trace from the SW-pin?










share|improve this question







New contributor




user3142695 is a new contributor to this site. Take care in asking for clarification, commenting, and answering.
Check out our Code of Conduct.











I'm trying to build my first two-layer PCB layout using this example schema:



enter image description here



I'm using SMD elements, which I would place on the top layer. Also I would create a ratsnet area as GND on the top layer.



I would create some ratsnet area for the SW pin, the output inductor pins and the boost capacitor pins. In that areas I would put some vias and connect them with a ratsnet on the bottom layer.



I'm not quite sure if this is correct so far or if I misunderstood the example. Because then I do not understand the 'additional vias on the GND' of the capacitors.



If the GND area should be on the bottom layer, what about the trace from the SW-pin?







pcb pcb-design ground pcb-layers






share|improve this question







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user3142695 is a new contributor to this site. Take care in asking for clarification, commenting, and answering.
Check out our Code of Conduct.











share|improve this question







New contributor




user3142695 is a new contributor to this site. Take care in asking for clarification, commenting, and answering.
Check out our Code of Conduct.









share|improve this question




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user3142695 is a new contributor to this site. Take care in asking for clarification, commenting, and answering.
Check out our Code of Conduct.






user3142695 is a new contributor to this site. Take care in asking for clarification, commenting, and answering.
Check out our Code of Conduct.











  • What do you mean by a "ratsnest area"? Usually the "ratsnest" are the lines your CAD tool shows to indicate connections that haven't been made yet. There shouldn't be any ratsnest left when the design is complete.
    – The Photon
    1 hour ago










  • @ThePhoton I'm using Eagle CAD. Drawing a polygon and then use 'ratsnet'
    – user3142695
    1 hour ago
















  • What do you mean by a "ratsnest area"? Usually the "ratsnest" are the lines your CAD tool shows to indicate connections that haven't been made yet. There shouldn't be any ratsnest left when the design is complete.
    – The Photon
    1 hour ago










  • @ThePhoton I'm using Eagle CAD. Drawing a polygon and then use 'ratsnet'
    – user3142695
    1 hour ago















What do you mean by a "ratsnest area"? Usually the "ratsnest" are the lines your CAD tool shows to indicate connections that haven't been made yet. There shouldn't be any ratsnest left when the design is complete.
– The Photon
1 hour ago




What do you mean by a "ratsnest area"? Usually the "ratsnest" are the lines your CAD tool shows to indicate connections that haven't been made yet. There shouldn't be any ratsnest left when the design is complete.
– The Photon
1 hour ago












@ThePhoton I'm using Eagle CAD. Drawing a polygon and then use 'ratsnet'
– user3142695
1 hour ago




@ThePhoton I'm using Eagle CAD. Drawing a polygon and then use 'ratsnet'
– user3142695
1 hour ago










2 Answers
2






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up vote
3
down vote














I'm not quite sure if this is correct so far or if I misunderstood the
example. Because then I do not understand the 'additional vias on the
GND' of the capacitors.




Vias have inductance, with a few nH each (depending on the size and this can be calculated). If you parallel vias, you are also paralleling their inductance and so by doubling vias, you half the inductance. Parasitic inductance creates further losses and lower rise times in switching applications, so a decrease in inductance is a good thing. Vias also have a small amount of resistance also, so parallel vias also decreases the resistance.




If the GND area should be on the bottom layer, what about the trace
from the SW-pin?




The trace from the SW pin would go on one of the internal layers or bottom layer if using a 4 layer design (SIG-GND-PWR-SIG). If you have a 4 layer stackup, the ground layer is probably on one of the internal planes (ideally).



If your using a 2 layer design then the SW trace would go on the bottom layer, and the GND would be on the top.






share|improve this answer




















  • Oh, great. Thanks. So the vias in the ground are just put on the GND, they are not there to take the signal from one layer to another, right? Could you provide an example how to calculate which size I do need?
    – user3142695
    1 hour ago

















up vote
2
down vote













I would put Gnd layer on both sides where ever there is not a signal. Connect the layers with vias named Gnd. Lots of Gnd coverage, lots of vias. More Gnd never hurt anything, and it's less copper to remove from the copper plated board.



I buy boards from iteadstudio.com regularly, I leave all Gnd on I can.






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    2 Answers
    2






    active

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    2 Answers
    2






    active

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    active

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    up vote
    3
    down vote














    I'm not quite sure if this is correct so far or if I misunderstood the
    example. Because then I do not understand the 'additional vias on the
    GND' of the capacitors.




    Vias have inductance, with a few nH each (depending on the size and this can be calculated). If you parallel vias, you are also paralleling their inductance and so by doubling vias, you half the inductance. Parasitic inductance creates further losses and lower rise times in switching applications, so a decrease in inductance is a good thing. Vias also have a small amount of resistance also, so parallel vias also decreases the resistance.




    If the GND area should be on the bottom layer, what about the trace
    from the SW-pin?




    The trace from the SW pin would go on one of the internal layers or bottom layer if using a 4 layer design (SIG-GND-PWR-SIG). If you have a 4 layer stackup, the ground layer is probably on one of the internal planes (ideally).



    If your using a 2 layer design then the SW trace would go on the bottom layer, and the GND would be on the top.






    share|improve this answer




















    • Oh, great. Thanks. So the vias in the ground are just put on the GND, they are not there to take the signal from one layer to another, right? Could you provide an example how to calculate which size I do need?
      – user3142695
      1 hour ago














    up vote
    3
    down vote














    I'm not quite sure if this is correct so far or if I misunderstood the
    example. Because then I do not understand the 'additional vias on the
    GND' of the capacitors.




    Vias have inductance, with a few nH each (depending on the size and this can be calculated). If you parallel vias, you are also paralleling their inductance and so by doubling vias, you half the inductance. Parasitic inductance creates further losses and lower rise times in switching applications, so a decrease in inductance is a good thing. Vias also have a small amount of resistance also, so parallel vias also decreases the resistance.




    If the GND area should be on the bottom layer, what about the trace
    from the SW-pin?




    The trace from the SW pin would go on one of the internal layers or bottom layer if using a 4 layer design (SIG-GND-PWR-SIG). If you have a 4 layer stackup, the ground layer is probably on one of the internal planes (ideally).



    If your using a 2 layer design then the SW trace would go on the bottom layer, and the GND would be on the top.






    share|improve this answer




















    • Oh, great. Thanks. So the vias in the ground are just put on the GND, they are not there to take the signal from one layer to another, right? Could you provide an example how to calculate which size I do need?
      – user3142695
      1 hour ago












    up vote
    3
    down vote










    up vote
    3
    down vote










    I'm not quite sure if this is correct so far or if I misunderstood the
    example. Because then I do not understand the 'additional vias on the
    GND' of the capacitors.




    Vias have inductance, with a few nH each (depending on the size and this can be calculated). If you parallel vias, you are also paralleling their inductance and so by doubling vias, you half the inductance. Parasitic inductance creates further losses and lower rise times in switching applications, so a decrease in inductance is a good thing. Vias also have a small amount of resistance also, so parallel vias also decreases the resistance.




    If the GND area should be on the bottom layer, what about the trace
    from the SW-pin?




    The trace from the SW pin would go on one of the internal layers or bottom layer if using a 4 layer design (SIG-GND-PWR-SIG). If you have a 4 layer stackup, the ground layer is probably on one of the internal planes (ideally).



    If your using a 2 layer design then the SW trace would go on the bottom layer, and the GND would be on the top.






    share|improve this answer













    I'm not quite sure if this is correct so far or if I misunderstood the
    example. Because then I do not understand the 'additional vias on the
    GND' of the capacitors.




    Vias have inductance, with a few nH each (depending on the size and this can be calculated). If you parallel vias, you are also paralleling their inductance and so by doubling vias, you half the inductance. Parasitic inductance creates further losses and lower rise times in switching applications, so a decrease in inductance is a good thing. Vias also have a small amount of resistance also, so parallel vias also decreases the resistance.




    If the GND area should be on the bottom layer, what about the trace
    from the SW-pin?




    The trace from the SW pin would go on one of the internal layers or bottom layer if using a 4 layer design (SIG-GND-PWR-SIG). If you have a 4 layer stackup, the ground layer is probably on one of the internal planes (ideally).



    If your using a 2 layer design then the SW trace would go on the bottom layer, and the GND would be on the top.







    share|improve this answer












    share|improve this answer



    share|improve this answer










    answered 1 hour ago









    laptop2d

    20.9k123071




    20.9k123071











    • Oh, great. Thanks. So the vias in the ground are just put on the GND, they are not there to take the signal from one layer to another, right? Could you provide an example how to calculate which size I do need?
      – user3142695
      1 hour ago
















    • Oh, great. Thanks. So the vias in the ground are just put on the GND, they are not there to take the signal from one layer to another, right? Could you provide an example how to calculate which size I do need?
      – user3142695
      1 hour ago















    Oh, great. Thanks. So the vias in the ground are just put on the GND, they are not there to take the signal from one layer to another, right? Could you provide an example how to calculate which size I do need?
    – user3142695
    1 hour ago




    Oh, great. Thanks. So the vias in the ground are just put on the GND, they are not there to take the signal from one layer to another, right? Could you provide an example how to calculate which size I do need?
    – user3142695
    1 hour ago












    up vote
    2
    down vote













    I would put Gnd layer on both sides where ever there is not a signal. Connect the layers with vias named Gnd. Lots of Gnd coverage, lots of vias. More Gnd never hurt anything, and it's less copper to remove from the copper plated board.



    I buy boards from iteadstudio.com regularly, I leave all Gnd on I can.






    share|improve this answer
























      up vote
      2
      down vote













      I would put Gnd layer on both sides where ever there is not a signal. Connect the layers with vias named Gnd. Lots of Gnd coverage, lots of vias. More Gnd never hurt anything, and it's less copper to remove from the copper plated board.



      I buy boards from iteadstudio.com regularly, I leave all Gnd on I can.






      share|improve this answer






















        up vote
        2
        down vote










        up vote
        2
        down vote









        I would put Gnd layer on both sides where ever there is not a signal. Connect the layers with vias named Gnd. Lots of Gnd coverage, lots of vias. More Gnd never hurt anything, and it's less copper to remove from the copper plated board.



        I buy boards from iteadstudio.com regularly, I leave all Gnd on I can.






        share|improve this answer












        I would put Gnd layer on both sides where ever there is not a signal. Connect the layers with vias named Gnd. Lots of Gnd coverage, lots of vias. More Gnd never hurt anything, and it's less copper to remove from the copper plated board.



        I buy boards from iteadstudio.com regularly, I leave all Gnd on I can.







        share|improve this answer












        share|improve this answer



        share|improve this answer










        answered 1 hour ago









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